APR-5000-DZ Array Package Rework System
Dual convection heating for lead-free and high thermal demands.
This latest addition to the APR-5000 Platform is designed to facilitate rework of high thermal demand boards, including lead-free and multi-layer assemblies, up to 12" x 12" (305mm x 305mm). This system meets all critical requirements with highly targeted and well controlled heating on the board assembly.
Considered ideal for small, high density boards used in products such as mobile phones, handheld instruments and personal media players, it enhances and enables fast ramp and tighter delta temperature control without affecting adjacent and underside components.
The APR-5000-DZ System has a US Patented, dual convection bottom-side heater that consists of both a large area and small area (localized) heater. When used together with the top-side convection heater during rework, faster heating rates with small temperature deltas are achieved.
In addition, the rework process is supported with precision alignment control and an integrated vision system. A unique, new strobe light facilitates viewing the dual image of both component and board. The application software provides you highly intuitive, easy to use profi ling tools. Once you establish profi les, they can be saved and shared across APR-5000 and APR-5000-DZ systems with cross-system repeatability to 5° C.
System Part Numbers and Specifications
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| FEATURES & BENEFITS |
| Features |
Benefits |
| Powerful & capable for today's challenges 200-240VAC 2600W of total power | Reliable and repeatable in addressing lead-free requirements: higher reflow temp and tighter temperature control. |
| Backward compatible profiles | APR-5000 profiles are thermally compatible and can be used in APR-5000-DZ Systems. |
| Dual zone preheating | More precise delta temperature control and faster temperature ramp on reworked devices. Minimizes adjacent, underside components from thermal damage when bottom nozzles are used. |
| Dual zone cooling | Fast cooling when dual zone fans are selected to be on simultaneously during the cooling stage of profile. |
| 0201/0402/0605/μ SMD tape feeder rework built in software sequence | Computer script to guide operator through picking, aligning, placing and reflowing 0201/0402/0605/μ SMD devices from tape feeders. |
| Allows PDF document to be associated with process files | To improve operation efficiency, operator instructions can "pop" up before starting process. |
| Top & bottom strobe light control | Improves contrast between reworked device and land pattern during alignment. |
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| SYSTEMS |
| Part No. |
Description |
| APR-5000-DZ | 200-240 VAC Array Package Rework System |
| APR-5000-DZ-TAB | 200-240 VAC Array Package Rework System with XY Table |
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| SYSTEMS INCLUDE |
| Part No. |
Description |
| VNZ-12 | Vacuum Pick-Up Nozzle 12mm O/D |
| VNZ-08 | Vacuum Pick-Up Nozzle 8mm O/D |
| VNZ-05 | Vacuum Pick-Up Nozzle 5mm O/D |
| VNZ-03 | Vacuum Pick-Up Nozzle 3mm O/D |
| VNZ-01 | Vacuum Pick-Up Nozzle 1mm O/D |
| FS-APR | PCB Support Finger Short (4 included)* |
| FSL-APR | PCB Spring Support Finger Long
(4 included with APR-5000, 8 with APR-5000-XLS/XL) |
| UBS-APR | Under Board Support* |
| APR-TC3 | Color Fine Gauge Thermocouples (includes 3)* |
| 19782 | Adjustable BGA Centering Nest** |
| 20987 | Adjustable CSP Centering Nest |
| 20534 | Squeegee Blade Holder for Printing |
| SOFT-APR-5000-DZ | Installation Software*** |
| Cables | Power, Communication & Video Cables |
| (*APR-5000-DZ / -TAB, *** APR-5000-DZ-TAB) |
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| TECHNICAL SPECIFICATIONS |
| Input Voltage |
200-240 VAC,
50/60 Hz
20 Amp Single Phase
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| Power Consumption |
| System Total |
2600 W |
| Pre-Heater |
1800 W |
| Inner Zone |
900 W |
| Outer Zone |
1800 W |
| Reflow Heater |
550 W |
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Temperature Control Type
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Closed-Loop Control
(RTD Sensors)
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Maximum Source Temperature
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| Reflow Head |
400 °C (752 °F) |
| Pre-Heater |
350 °C (662 °F) |
| Airflow |
| Control |
Pre-Set to 8,16 & 24 l/min |
| Supply |
Self-Contained Pump |
Nitrogen
Input |
Standard Feature
(requires 65psi or 4.6 bar) |
| Component Handling |
| Maximum Size |
1.4" x 1.4" (35mm x 35mm) |
| Minimum Size |
0.020" x 0.010"
(0.51mm x 0.25mm) |
| Maximum Weight |
55g (1.94oz) |
| PCB Handling Capability |
| Maximum Size |
15" x 9"
(381mm x 229mm) |
Rework Area
Optional large rail kit
(APR-5000-DZ only ) |
9" x 12"
(229mm x 305mm)
w/APR-LRK Large Rail Kit |
| Aligned inner preheater and reflow heater |
8" x 8" (203 mm x 203 mm)
not suggested without XY table |
| Maximum Thickness |
0.25 "(6mm) |
| XY Table |
Standard on APR-5000-DZ-TAB
Optional on APR-5000-DZ |
| Vision |
| Maximum Field of View |
1.4" x 1.4"
(35mm x 35mm) |
| System Dimensions |
| W x D x H |
19" x 30" x 30"
(483mm x 762mm x 762mm) |
| Weight |
130lbs (60Kg) |
| System Warranty |
1 Year (Excluding Consumables) |
| Agency Approvals |
CE
cETLus
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