APR-5000-DZ Array Package Rework System

Design and functionality come together in the compact and powerful APR-5000-DZ Advanced Package Rework System. This system provides closed-loop control, optimized vision and precise component placement on a compact platform of 19" x 30" (483mm x 762mm). Self contained pumps are standard on this compact platform allowing for easy benchtop setup.

Capable of handling boards up to 15" x 7.75" (381mm x 197mm) with standard fixtures (larger PCB Holder options exist if required) with a placement accuracy to 0.001" (0.025mm) and interconnection pitches as low as 0.012" (0.3mm), the APR-5000-DZ is ideal for reworking smaller assemblies such as cell phones and laptop computers.

The APR-5000-DZ System incorporates powerful, efficient and fast response convective top reflow heater and bottom dual zone preheaters for delivering fast ramp and tight delta temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked components.

The single reflow/placement head can be moved to the correct position for rework allowing PCB assemblies with 2" (50mm) underside components to be stationary mounted above the pre-heater. An optional XY table (APR-TAB) can be added to minimize operator fatigue and is ideal for small PCB assemblies with less than .25" (6.4mm) underside components. In addition, the APR-5000-DZ-TAB is an APR-5000-DZ system with a pre-assembled XY table.

The system also incorporates an exclusive integral vision system that makes viewing, aligning and accurately placing a component easy by allowing operators to simultaneously view the topside of the PCB and a superimposed image of the underside of the component. Then, with micrometer adjustment, images can be accurately aligned in the X, Y & Theta axes prior to placement. In addition, integrating the vision system with the machine's software eliminates the need for multiple monitors.

System Part Numbers and Specifications

	FEATURES & BENEFITS Features Benefits Powerful & capable for today's challenges 200-240VAC 2600W of total power Reliable and repeatable in addressing lead-free requirements: higher reflow temp and tighter temperature control. Backward compatible profiles APR-5000 profiles are thermally compatible and can be used in APR-5000-DZ Systems. Dual zone preheating More precise delta temperature control and faster temperature ramp on reworked devices. Minimizes adjacent, underside components from thermal damage when bottom nozzles are used. Dual zone cooling Fast cooling when dual zone fans are selected to be on simultaneously during the cooling stage of profile. 0201/0402/0605/μ SMD tape feeder rework built in software sequence Computer script to guide operator through picking, aligning, placing and reflowing 0201/0402/0605/μ SMD devices from tape feeders. Allows PDF document to be associated with process files To improve operation efficiency, operator instructions can "pop" up before starting process. Top & bottom strobe light control Improves contrast between reworked device and land pattern during alignment.

	SYSTEMS Part No. Description APR-5000-DZ 200-240 VAC Array Package Rework System APR-5000-DZ-TAB 200-240 VAC Array Package Rework System with XY Table

	SYSTEMS INCLUDE Part No. Description VNZ-19 Vacuum Pick-Up Nozzle 19mm O/D VNZ-08 Vacuum Pick-Up Nozzle 8mm O/D VNZ-05 Vacuum Pick-Up Nozzle 5mm O/D VNZ-03 Vacuum Pick-Up Nozzle 3mm O/D (2.39mm/.094" internal & 3.17mm/.128" external) VNZ-01 Vacuum Pick-Up Nozzle 1mm O/D (.76mm/.03" internal & 1.56mm/.06" external) FS-APR PCB Support Finger Short (4 included) FSL-APR PCB Spring Support Finger Long (4 included with APR-5000) UBS-APR Under Board Support APR-TC3 Color Fine Gauge Thermocouples (includes 3) 20987 Adjustable CSP Centering Nest 19782 Adjustable BGA Centering Nest 20534 Squeegee Blade Holder for Printing SOFT-APR-5000-DZ Installation Software Cables Power, Communication & Video Cables

	OPTIONAL ACCESSORIES Part No. Description VNZ-12 Vacuum Pick-Up Nozzle 12mm O/D VNZ-005 Vacuum Pick-Up Nozzle 0.5mm O/D (.25mm/.010" int. & 1.02-0.76mm/.04-.03" ext.) FS-APR-2 PCB Support Finger Short (Pack of 2) FL-APR-2 PCB Support Finger Long (Pack of 2) FSL-APR-2 PCB Spring Support Finger Long (Pack of 2) FSS-APR-2 PCB Spring Support Finger Short (Pack of 2) FLS-APR-2 Large PCB Finger Short (Pack of 2) FLL-APR-2 Large PCB Finger Long (Pack of 2) FLSS-APR-2 Large PCB Spring Finger Short (Pack of 2) FLSL-APR-2 Large PCB Spring Finger Long (Pack of 2) PF-1 Print Preparation Plate VAC-P100 Self-adhesive plates for removal of non-uniform components APR-LRK PCB Large Rail Kit. Fits boards up to 12" x 12" (30.5cm x 30.5cm) APR-TAB XY board holder and placement table for APR-5000-DZ APR-MRS-DEMOPCB Demonstration PCB APR-MRS-DEMOKIT Demonstration PCB Kit with: - 5 x res, zero Ohm, 0201SMR-PA-10K-0 - 5 x res, zero Ohm, 0402SMR-PA-10K-0 - 5 x res, zero Ohm, 0603SMR-PA-10K-0 - 5 x micro SMD, 4 bump, 0.5 mm pitch - 5 x micro SMD, 5 bump, 0.5 mm pitch - 5 x micro SMD, 8 bump, 0.5 mm pitch - 5 x micro SMD, 10 bump, 0.5 mm pitch - 5 x LLP LDA16A - 5 x LLP, plastic, Quad 4x4x0.75 mm body,16LD, 0.5 mm pitch - 5 x LLP, plastic, Quad 5x4x0.75 mm body 24LD, 0.5 mm pitch - 5 x LLP, plastic, Quad 7x7x0.75 mm body 44LD, 0.5 mm pitch - 4 x PBGA 27 mm 256 balls, 1.27 mm pitch - 3 x PBGA 17 mm 256 balls, 1.0 mm pitch - 1 x PBGA 35 mm 388 balls, 1.27 mm pitch - 1 x POP Bottom 305 balls 12 mm, 0.5 mm pitch - 1 x Top of POP 128 balls 12 mm, 0.65 mm pitch - 4 x CVBGA (thin BGA) 97 balls 5 mm, 0.4 mm pitch - 4 x LGA/MLF100 pin 12 mm fine pitch, 0.4 mm pitch - 4 x PLCC 44 pin 16 mm, 1.27 mm pitch - 4 x QFP 44 10 mm by 10 mm, 0.8 mm pitch - 4 x QFP 100 14 mm by 20 mm, 0.65 mm pitch - 4 x CTBGA 228 12 mm by 12 mm, 0.5 mm pitch - 1 x fusion pack (combination 116 QFN & 100 QFP in one package .4 mm pitch)

	TECHNICAL SPECIFICATIONS Input Voltage 200-240 VAC, 50/60 Hz 20 Amp Single Phase Power Consumption   System Total 2600 W   Pre-Heater 1800 W Inner Zone 900 W Outer Zone 1800 W   Reflow Heater 550 W Temperature Control Type Closed-Loop Control (RTD Sensors) Maximum Source Temperature   Reflow Head 400 °C (752 °F)   Pre-Heater 350 °C (662 °F) Airflow   Control Pre-Set to 8,16 & 24 l/min   Supply Self-Contained Pump   Nitrogen   Input Standard Feature (requires 65psi or 4.6 bar) Component Handling   Maximum Size 1.9" x 1.9" (49mm x 49mm)   Minimum Size 0.020" x 0.010" (0.51mm x 0.25mm)   Maximum Weight 55g (1.94oz) PCB Handling Capability X x Y   Standard   With optional large rail kit APR-LRK 15" x 7.75" (381mm x 197mm) 15" x 10.75" (381mm x 273mm)   Maximum Size 15" x 9" (381mm x 229mm)   Rework Area Optional large rail kit (APR-5000-DZ only ) 9" x 7.75" (228mm x 197mm) 6.5" x 6.5" (165mm x 165mm) preheater and reflow heater   Maximum Thickness 0.25 "(6mm)   XY Table Standard on APR-5000-DZ-TAB Optional on APR-5000-DZ Vision   Maximum Field of View 1.6" x 1.6" (40mm x 40mm) System Dimensions   W x D x H 19" x 30" x 30" (483mm x 762mm x 762mm)   Weight 130lbs (60Kg) System Warranty 1 Year (Excluding Consumables) Agency Approvals CE cETLus