APR-5000 Series Array Package Rework Systems Accessories

The APR-5000 Series Array Package Rework Systems incorporate state-of-the-art vision, and closed-loop time, temperature and airflow control. Precision placement and powerful software make the rework of complex array packages easy, fast and reliable.

Economical and easy-to-use, the APR-5000 Series Array Package Rework Systems deliver best-in-class BGA/CSP functionality with professional performance at an affordable price. All machines incorporate the ideal combination of hardware features and automated software necessary for reworking today's array packages.

			Nozzles A comprehensive range of standard reflow nozzles available to suit the most common array packages available More »

			Component Stenciling Templates OK International has designed a unique tool, Component Stenciling Templates, for printing on the underside of components More »

			Dip Transfer This process involves dipping a component into gel flux, depositing an exact amount of flux. This process is quick, consistent and clean, and negates the need to clean after reflow. More »

			Tape Feeder Picking up small surface mount components with tweezers is not practical and may damage the component. This is a unique way of presenting small components to a rework machine. More »


		» Nozzles » Component Stenciling Templates » Dip Transfer » Tape Feeder


		» APR-5000 » APR-5000XLS

APR-5000 with Monitor