Dip Transfer

This process involves dipping a component into gel flux, depositing an exact amount of flux. This process is quick, consistent and clean, and negates the need to clean after reflow. Available for both solder balled and leaded devices. All kits are supplied with a metal spatula.

	DIP TRANSFER ACCESSORIES Part No. Array Package DTP-BGA Set of 3 plates, apertures 28, 35 & 45mm, depth 0.012" (0.30mm) DTP-CSP Set of 3 plates, apertures 10, 16, & 21mm, depth 0.006" (0.15mm) DTBK-USMD Kit, uSMD Flux Transfer Blocks, set of 2 blocks, depth 0.003" (0.08mm) and 0.004" (0.10mm) DTBK-FC Kit, Flip Chip Flux Transfer Blocks, set of 2 blocks, depth 0.001" (0.025mm) and 0.002" (0.051mm)