Dip Transfer

This process involves dipping a component into gel flux, depositing an exact amount of flux. This process is quick, consistent and clean, and negates the need to clean after reflow. Available for both solder balled and leaded devices. All kits are supplied with a metal spatula.

	DIP TRANSFER ACCESSORIES Part No. Array Package DTP-BGA Set of 3 plates, apertures 28, 35 & 45mm, depth 0.012" (0.30mm) used for 1.27mm pitch 30 Mil BGA balls (.76mm) DTP-CSP Set of 3 plates, apertures 10, 16 & 21mm, depth 0.006" (0.15mm) BGA/CSP used for BGAs with 12 Mil balls (.3mm dia) DTP-40-8 8 Mil dip plate standard for 1mm pitch BGA with 20 Mil balls 0.02" (0.5mm) DTBK-USMD Kit, uSMD Flux Transfer Blocks, set of 2 blocks, depth 0.003" (0.08mm) and 0.004" (0.10mm) used for solder balls 6-8 Mil (.15-2mm dia) DTBK-FC Kit Flip Chip Flux Transfer Blocks, set of 2 blocks, depth 0.001" (0.025mm) and 0.002" (0.051mm)