Component Stenciling Templates

OK International has designed a unique tool, Component Stenciling Templates, for printing on the underside of components. This easy procedure is designed for use on PBGA, CBGA, CSP balled devices as well as Land Grid Array (LGA) components. This is an ideal process for small components and situations where traditional stencil access is limited by the close proximity of adjacent components.

	COMPONENT STENCILING TEMPLATES Part No. Array Package BST-256 256 Full Matrix Array BST-256P 256 Perimeter Array BST-256FP 256 Fine-Pitch Full Matrix Array BST-272P+16 272 Perimeter Array With 16 Inner BST-303 303 Full Matrix Array BST-324 324 Full Matrix Array BST-352P 352 Perimeter Array BST-357 357 Full Matrix Array BST-492 492 Full Matrix Array BRP-LDA16A NSC LLP 16 Pin Dual In-Line BRP-LQA16A NSC LLP 16 Pin Quad BRP-LQA24A NSC LLP 24 Pin Quad BRP-LQA44A NSC LLP 44 Pin Quad BRP-KIT-LGA100-04 Full kit (3pcs) w/ base fixture, pattern & body plates for LGA100-0.4mm (also incl. clamp & squeegee) BRP-KIT-BASE BRP kit base fixture only BRP-KP-LGA100-04 Kit plates (2pcs), pattern and body plates only (minus base) for LGA100-0.4mm BRP-KIT-FUSION-216 Full kit (3pcs) w/ base fixture, pattern & body plates for Fusion pack 216 (incl. clamp & squeegee) BST-256-100 Standard BST plate, clamp & squeegee, PBGA 256, 1.0mm pitch BST-256-127 Standard BST plate, clamp & squeegee, PBGA 256, 1.27mm pitch BST-388-127 Standard BST plate, clamp & squeegee, PBGA 388, 1.27mm pitch BRP-KP-FUSION-216 Kit plates pattern & body plates only (minus base) for Fusion pack 216