Component Stenciling Templates

OK International has designed a unique tool, Component Stenciling Templates, for printing on the underside of components. This easy procedure is designed for use on PBGA, CBGA, CSP balled devices as well as Land Grid Array (LGA) components. This is an ideal process for small components and situations where traditional stencil access is limited by the close proximity of adjacent components.

	COMPONENT STENCILING TEMPLATES Part No. Array Package BST-169 169 Full Matrix Array BST-225 225 Full Matrix Array BST-256 256 Full Matrix Array BST-256P 256 Perimeter Array BST-256FP 256 Fine-Pitch Full Matrix Array BST-272P+16 272 Perimeter Array With 16 Inner BST-303 303 Full Matrix Array BST-324 324 Full Matrix Array BST-352P 352 Perimeter Array BST-357 357 Full Matrix Array BST-492 492 Full Matrix Array CST-46 46 Ball Micro BGA BRP-LDA16A NSC LLP 16 Pin Dual In-Line BRP-LQA16A NSC LLP 16 Pin Quad BRP-LQA24A NSC LLP 24 Pin Quad BRP-LQA44A NSC LLP 44 Pin Quad