HCT-900 Hand Held Convection Tool

The HCT-900 Hand Held Convection Tool offers a low cost, versatile rework solution for a wide variety of production and rework application challenges. It has a compact, robust design comprising of analog controls for both airflow and heat. A closed loop feedback circuit controls the temperature allowing the desired temperature to be achieved and maintained regardless of changes in the volume of airflow.

The HCT-900 can be used for the removal and replacement of electronic components, including lead-free, from 0201 up to 304 pin QFP. It is also effective at reworking pin in-hole devices such as sockets and connectors. And, using it with solder braid and flux is a fast and efficient way to remove solder shorts and splashes. It can also be used in plastic applications such as applying shrink wrap to components or the formation of plastic rivets.

The unique low noise air pump (less than 45 db) provides precise airflow control for the most demanding applications. The "power off" cool down function retains airflow through the hand piece while the unit powers down, providing efficient heater cooling and reducing thermal stress.

The HCT-900 is fully ESD compliant.

	SYSTEMS Part No. Description HCT900-10 100 VAC, Hand Held Convection Tool HCT900-11 100/120 VAC, Hand Held Convection Tool HCT900-21 220/240 VAC, Hand Held Convection Tool

Nozzle Selection

The HCT-900 is supplied with a standard single jet H-D50 (0.2", 5.0 mm) nozzle. In addition two rework nozzle kits, predefined for specific applications, are available.

	NOZZLES Part No. Description NZKT-1 Nozzle Kit for Chip Resistors, SOIC & TSOP Packages. Includes(one each):  H-D25  H-SL16  H-SL28  H-SOJ40  H-TS48 NZKT-2 Nozzle Kit for PLCC, QFP & BQFP packages. Includes(one each):  H-P20  H-P44  H-P84  H-Q1420  H-Q2626

	COMPLETE NOZZLE SELECTION PLCC,BQFP,QFP Model Chip Type A (mm) B (mm) H-P20 PLCC-20 11.9 11.9 H-P28 PLCC-28 14.5 14.5 H-P32 PLCC-32 16.9 14.3 H-P44 PLCC-44 19.5 19.5 H-P52 PLCC-52 22.0 22.1 H-P68 PLCC-68 27.0 27.2 H-P84 PLCC-84 32.4 32.4 H-Q07 QFP-48 8.4 8.4 H-Q10 QFP-44 13.4 13.4 H-Q14 QFP-52,80 17.3 17.3 H-Q1420 QFP-64,80,100 23.4 18.1 H-Q28 QFP-120,128,144,160 31.2 31.2 H-BQ23 BQFP-100 22.4 22.4 H-Q3232 QFP-240 34.5 34.5 H-BQ38 BQFP-196 37.7 37.7 H-Q2626 QFP-208 29.8 29.8 SOIC, TSOP Model Chip Type A (mm) B (mm) H-S16 SOIC 14,16 6.8 10.2 H-SL16 SOL 14,16 10.6 10.8 H-SL20 SOL 20,20J 10.6 13.3 H-SL24 SOL 24,24J 10.6 15.9 H-SL28 SOL 28 10.6 18.4 H-SL44 SOL 44 16.0 27.9 H-SOJ32 SOJ 32 13.5 20.6 H-SOJ40 SOJ 40 13.5 25.4 H-TS24 TSOP 20-24 17.0 7.1 H-TS32 TSOP 28-32 21.0 9.1 H-TS40 TSOP 40 21.0 10.8 H-TS48 TSOP 48 21.0 13.3 H-TSW24 TSOP 20-24 10.2 18.4 H-TSW44 TSOP 24-28/40-44 12.7 19.8 CHIP & SOT Model Ø A (mm) H-D25 2.5 H-D50 5.0 H-D120 12.0