Metcal Array Package Rework systems are advanced, versatile machines offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today’s leading edge BGA, CSP, Land Grip Array (LGA), micro SMD, Micro-lead Frame (MLF) and Bumped Chip Component packages. Convection Rework System, BGA Rework


Convection Rework System Series

Metcal Array Package Rework systems are advanced, versatile machines offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today’s leading edge BGA, CSP, Land Grip Array (LGA), micro SMD, Micro-lead Frame (MLF) and Bumped Chip Component packages.

Precision placement and powerful software make the rework of complex array packages easy, fast and reliable. Easy-to-use, the Metcal APR Series delivers best-in-class BGA Rework at an affordable price.

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System Type
Manual & Modular 
 Semi Automated

 Board Size - Small

MRS-1100A Modular Rework System
APR Rework Systems


Board Holders for MRS Series 

 Board Holders for APR Series Under Board Support

 BH-2000    UBS-SRS


 Board Holder / Placement table

Large PCB rail kit 


Copy of accessories-for-MRS-series.jpg

Accessories for MRS Series

Accessories for APR Series

 Adjustable Tool Holder

   Upgrade Kits

   PCB Support Finger
     Stenciling Templates
SBK-CHIPRP-KIT Solder Ball chip Reball Placement Kit    Dip Transfer
   Tape Feeder
   Demo PCB Kit
   Misc Accessories
01005 - 0201 - Solder Ball Kit
 Double Sided Rework

Lead Free Array Rework 

 Micro SMD Rework

 PoP Rework

Flux Dip Process 

 Reworking TIU PCB's

 BGA Pad Clean Up

Reballing Kit 

MRS-1000 Series Profiling 

LGA & QFN Rework 

Removal with Tweezer Nozzles 

MRS-1000 Series Set up 

 APR Series Applications

 Rework Fusion Quad Pack

    MRS-1100A Modular Rework System
The MRS-1100A Modular Rework System is an integrated convection rework system for the removal and reflow of BGA/CSP and SMT components. The MRS-1100A is comprised of a hand held convection tool, preheater, adjustable tool holder, and free-standing board holder to create a manually assisted rework system. A series of nozzles, targeting a variety of applications, and optional light magnifier round out the product offering for this system.

With standard features such as programmability, a digital display, program storage of up to 50 profiles, this system is not only versatile, but also easy and efficient to work with. A choice of board holders and accessories are available that make the system capable of
handling multiple sizes of PCBs.

The MRS-1100A allows you the choice of using either the embedded profiling capability that can be configured to operate at a fixed temperature, or a four zone programming option. The unit also allows the temperature to be controlled either at the heat output (internal) or at the board (external). The “external” control function uses a thermocouple which can be placed on the board or a component.
>> View all Systems     >> Download Product Information     >> Download User Manual

  APR Scorpion Rework System
The Scorpion Advanced Package Rework System ensures both accurate component placement and custom tailored reflow profiles in one user friendly, single platform rework system. The Scorpion System redefines precision and addresses the technical demands presented by component manufacturers today. The challenges of array package rework, and the inability to easily inspect placement accuracy, call for a solution that allows for simultaneous viewing of Printed Circuit Board pads and component balls for accurate placement.

The Scorpion Rework System fills this need with quick, accurate placement through the use of an all new vision system employing dual image overlay technology. This new vision system features LED lighting both top and bottom for shadow-free component visualization and component alignment. The HD camera is ready to go out of the box.
The two-head modular design allows the Scorpion Rework System to be tailored to the users specific rework needs and allows precision alignment of the smallest BGAs, QFNs and Micro SMDs with the highest accuracy. The open-ended board holder fits a wide variety of large, small and odd-shaped boards while allowing precise positioning over the patented dual subzone preheater.

The standard auto-profile mode ensures fast and easy profile creation with a minimum of setup time. By selecting your tempera- ture targets any operator can quickly and accurately create reflow profiles for a wide variety of boards, and then save them in memory for future use. Source temperatures and time intervals can be modified “On-the-Fly", eliminating the need to wait for the current profile to terminate before modifications can be made. Precise solder joint temperatures are measured and displayed on a real time graphical display, thus providing the necessary data to accurately and easily establish the optimum reflow profile for each particular application within minutes.

The modular design of the Scorpion Rework System allows it to be configured to the users specific needs. The two-head system with precision placement package features placement accuracy to 0.0015" (.038mm). The standard single-head system provides placement accuracy to 0.004" (.1mm). The Scorpion system accepts the full range of APR and QX series reflow nozzles. Flux transfer plates and solder paste plates are available to ensure repeatable process control during the replacement operation.
>> View all Systems     >> Download Product Information     >> Download User Manual     >> Software Download


  APR-5000-XLS Array Package Rework System
System provides board capability with small board precision. This system performs precise, cost effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.5mm x 0.25mm). 

The flexible APR-5000-XLS System incorporates dual stage pre-heaters and has the thermal capacity and control to execute precise profiles of both large and small PCBs, delivering uniform temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked component.

Motorized X,Y,Z adjustments speed placement and help ensure process repeatability. In addition, motorized Theta axis provides 360º rotation to simplify component orientation. Together, these advanced controls reduce operator fatigue, improve placement accuracy and provide process consistency.

Featured on the APR-5000-XLS Advanced Package Rework System is an innovative Split Vision System, which allows operators to view the opposite corners of a component, including splitting on rectangular components, with the necessary magnification to make its placement and registration fast and accurate.
>> View all Systems     >> Download Product Information     >> Download User Manual     >> Software Download

  APR Series – Software Download

SCORPION Series Software Updates
Download the latest version of the Scorpion software here.

Installation Instructions:
     1. Download the latest version of software and Unzip file. 
     2. Transfer file "Update.img" to a USB Flash drive with a 2GB or greater capacity
     3. Turn the power OFF to the Scorpion
     4. Insert the USB Flash drive with the software into an available USB port
     5. Turn the power on to the Scorpion
     6. The system will automatically detect and install new software
     7. Eject and remove the USB Flash drive when complete
  Date Product  Download Version 
   11/15/2012  Scorpion  102MB  R1.04

APR-5000 Series Software Updates
Note: You will need to have Adobe Acrobat Reader for using the APR-5000 Series Software. If you do not have Acrobat, please click HERE to download

Metcal has upgraded the power output of its APR-5000-XL and APR-5000-XLS machines in order to handle extremely demanding rework applications. These new machines also require updated software to run both sets of under-board heaters at the same time. Please note that this new software will NOT run on previous generation machines as their internal hardware and wiring are not designed to handle the increased current (Amps) required by the new software.

The software (Version 2.03.25) in the first box below can only be used on the APR-5000-XLS, Serial Number 002000 or higher or the APR-5000-XL, Serial Number 001500 or higher. 
OK International has also upgraded the power output of its APR-5000-DZ versions of the APR-5000 machine in order to handle extremely demanding rework applications. This new, updated software (Version 2.03.21), will run both sets of under-board heaters at the same time. Please note that this new software will not run on previous generation machines APR-5000E.

New features:
     • New dual simultaneously operating subzones provide additional power for faster and safer rework operations
     • New software enables fast and easy profiling
     • New subzone design speeds up the process while allowing the operating temperatures to remain lower protecting the component and the PCB

Key benefits:
     • Increased productivity
     • Precise thermal control across critical assembly regions
     • Reduction of rework cycle time protects the component under rework from thermal damage
     • Better management of the narrow lead-free process window without reaching excessive peak temperatures that damage components, connectors, other solder joints and the PCB substrate
     • To receive your software update, you will need the Serial Number (S/N) of your machine. It is located on the label on the back of the APR system, at the bottom left.

     1. Choose your APR-5000 model 
     2. Open Install Instructions document, APR Software Install Instructions for detailed information on how to install the software.
     3. Open the document Setting Passwords for APR Software for information on how to set passwords.
     4. Begin your download by clicking on the corresponding link below 
     5. To install the downloaded software, you will need to extract it first using winzip, which can be downloaded from here.
     6. The following is the latest versions of the APR-5000-XL(S) Series Software, 2.03.25 and the APR-5000-DZ Series Software, 2.03.21

APR-5000 Software update

  Date Product   Notes Download Version 
   11/05/2009  APR-5000-XL   S/N 001500 or higher 30MB  2.03.25
   11/05/2009  APR-5000-XLS  S/N 002000 or higher   30MB  2.03.25 
   06/23/2010  APR-5000-DZ    8.4MB  2.03.21

The 2007 software update included: 
      1. Strobe lighting with adjustable modulation rate, selectable top & bottom illumination control
      2. Thermal Tweezers Nozzle process for mechanical removal of odd form components, package on package, stacked devices and sockets
      3. New password protection mechanism offering full security control
      4. Detail Process Instruction that can be linked to any profile including pictures and diagrams
      5. User-friendly temperature and duration setting that allow real time adjustment for precise process control
      6. Selectable dual zone pre-heater for fast ramp up and efficient cooling, essential with lead-free. (Note: Only available on APR-5000-DZ & XL/S.)

The 2007 APR-SOFTWARE is backward compatible for all systems in the APR-5000 Series beginning with the serial number 00259. For systems that have serial numbers 00101 to 00258 please contact your local OK International Representative.

  Date Product   Notes Download Version 
   10/11/2007  APR-5000   S/N 00259 or higher 6.34MB  2.02.51
   10/11/2007  APR-5000-XL(S)  6.29MB  2.03.12 
   10/11/2007  APR-5000-DZ    6.40MB  2.03.12
             The following are downloads of older versions of APR-5000 Series Software, which do not include the upgrades.
Date Product Notes Download Version
11/07/2005 APR-5000 S/N 00259 or higher 6.40MB  2.01.20
11/07/2005 APR-5000-XL(S) 6.39MB  2.01.20

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